Blowing super-dry air (air having a dew-point temperature of -80℃) at the surface of a PC board at a high speed of 300 m/sec. instantly dries moisture on the surfaces of the PC board and innumerable through holes on it completely.

Movie（4.2MB）

• The UDG-βF dries the surface of a PC board and innumerable through holes on it instantly by blowing super-dry air at 300 m/sec. through a nozzles.
• Blows with super-dry air having a dew-point temperature of -80°C drying boards completely.
• Moisture is removed at the molecular level, without re-dewing on the product surface. Consequently, there are no oxidation stains resulting from incomplete drying.
• No squeezing roll is used leaving smears transfered from roller to the products.
• Quick drying saved drying time, and an extension of product line.]
• The heat-free drying process provides safety work.
• Board conditions
  Board thickness: 0.06 to 8 mm
  Through hole diameter: φ0.2 or more
  Board size: 50 x 50 to 1000 x 1000

Liquid Crystal Board Dryer “Model UDG-αF”

For Large-size Liquid Crystal Board Dryer “Model UDG-αFL”